[IEEE] Cu CMP Dishing Control for Fine Pitch Wafer-to-Wafer (W2W) Hybrid Bonding Closed
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Reward30points
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30
E-DOSA: Efficient Dataflow for Optimising SNN Acceleration
30
Embedded Cost-Effective VLSI Structures with Low-Power Scheduling and Spiking Convolutional Neural Network Inference
30
[Other]AnxiECG-PPG Database: Synchronized ECG and mobile PPG Signals during Baseline, Physical Activated, and Psychological Activated Conditions
