[Springer] Development of an Antioxidation Copper Paste with Self-Reducing Copper Formate and Molecular Dynamics Analysis of Sintering Mechanisms

formyscience Post time 2026-5-6 18:16:18 | Show all posts |Read mode
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Wang, F., Ma, J., Liu, J. et al. Development of an Antioxidation Copper Paste with Self-Reducing Copper Formate and Molecular Dynamics Analysis of Sintering Mechanisms. Acta Metall. Sin. (Engl. Lett.) 38, 1351每1360 (2025). https://doi.org/10.1007/s40195-025-01869-3

10.1007/s40195-025-01869-3

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jppw Post time 2026-5-6 18:16:19 | Show all posts

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