[Other] Multi-Objective Optimization of an Embedded Jet Microchannel Heat Sink for Thermal Management of High-Heat-Flux Ai Chips With Multiple Hotspots

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journalㄩJournal of Electronic Packaging

AuthorsㄩEnhui Feng; Zan Wu; Sihui Hong

Published dateㄩ--

DOIㄩ10.1115/1.4071961

PDF linkㄩhttps://asmedigitalcollection.as ... 3951/ep-26-1012.pdf

Article linkㄩhttps://doi.org/10.1115/1.4071961

Article SourceㄩASME International


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