[IEEE] Next Generation of Thermo-Compression Bonding Equipment

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journalㄩ2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)

AuthorsㄩJonathan Abdilla; Martin Kainz; Benedikt Pressl; Mario Fraubaum; Chris Scanlan

Published dateㄩ2024-12-3

DOIㄩ10.1109/eptc62800.2024.10909759

PDF linkㄩhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10909759

Article linkㄩhttps://doi.org/10.1109/eptc62800.2024.10909759

Article SourceㄩIEEE﹝


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