[IEEE] Survey of Chiplet Technology: SoC Architecture, Interconnect, EDA, and Advanced Packaging

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journalㄩIEEE Journal on Emerging and Selected Topics in Circuits and Systems

AuthorsㄩHongwei Liu; Yuan Du; Bo Pu; Guojun Yuan; Yuhang Liu; Linji Zheng; Pengchao Wang; An Yang; Yu Li; Chengming Yu; Fei Guo; Xiaoteng Zhao; Xuqiang Zheng; He Sun; Yongfu Li; Shaolin Xiang; Qinfen Hao

Published dateㄩ2025-12-

DOIㄩ10.1109/jetcas.2025.3636408

PDF linkㄩhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=11265742

Article linkㄩhttps://doi.org/10.1109/jetcas.2025.3636408

Article SourceㄩInstitute of Electrical and Electronics Engineers (IEEE)﹝


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Survey of Chiplet Technology: SoC Architecture, Interconnect, EDA, and Advanced Packaging

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