[Elsevier] Epoxy molding compounds for high-performance electronic packaging: A review on recent studies

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journalㄩMaterials Science in Semiconductor Processing

AuthorsㄩLee Eyann; Muhamed Abdul Fatah Muhamed Mukhtar; Abdullah Aziz Saad; Mariatti Jaafar

Published dateㄩ2025-10-

DOIㄩ10.1016/j.mssp.2025.109665

PDF linkㄩhttps://www.sciencedirect.com/sc ... 369800125004020/pdf

Article linkㄩhttps://doi.org/10.1016/j.mssp.2025.109665

Article SourceㄩElsevier BV﹝


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