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All topics(761235) waiting(1380) uploaded finished Dalily Life research

10 points

1 Reply

宋大学 Yesterday 21:12

Emotional conflict affects microsaccade dynamics in the emotional face–word Stroop task

Wiley
10 points

1 Reply

Krishna8222 Yesterday 21:12

Impact of microplastics on aquatic flora: Recent status, mechanisms of their toxicity and bioremediation strategies

Elsevier
30 points

2 Reply

srisandhiya@05 Yesterday 21:00

Improving Plant Disease Classification With Deep-Learning-Based Prediction Model Using Explainable Artificial Intelligence

IEEE
10 points

1 Reply

trieu_nguyen Yesterday 20:58

Team collaborative norms enhance students’ behavioral engagement in team-based flipped classrooms: A multilevel analysis

Elsevier
10 points

1 Reply

dr.elbiz Yesterday 20:57

Triboelectric-electromagnetic hybrid wind energy harvesting and multifunctional sensing device for self-powered smart agricultural monitoring

Elsevier
10 points

1 Reply

yassine123 Yesterday 20:57

Seismic collapse assessment of reinforced concrete frames infilled with hollow concrete bricks

Elsevier
30 points

1 Reply

raider99 Yesterday 20:56

Detection of Diseases and Nutrition in Bell Pepper

IEEE
30 points

1 Reply

shashimiryhaan Yesterday 20:52

Green Cloud: Navigating to a SustainableFuture Through Green Cloud Computing

IEEE
10 points

1 Reply

yukizb Yesterday 20:51

Efficacy of action competence training as a professional development strategy for equipping teachers with ESD readiness

Emerald
30 points

1 Reply

luckycomet001 Yesterday 20:47

SepAl: Sepsis Alerts on Low-Power Wearables With Digital Biomarkers and On-Device Tiny Machine Learning

IEEE
30 points

1 Reply

sunglin Yesterday 20:46

Die to Wafer Hybrid Bonding: Multi-Die Stacking with Tsv Integration

IEEE
30 points

1 Reply

sunglin Yesterday 20:46

A study on D2W Hybrid Cu bonding Technology for HBM Multi-die Stacking

IEEE
30 points

1 Reply

sunglin Yesterday 20:45

Enabling Die-to-Wafer Hybrid Bonding for the Next Generation Advanced 3D Packaging

IEEE
30 points

1 Reply

sunglin Yesterday 20:45

D2W Hybrid Bonding Challenges for HBM

IEEE
30 points

1 Reply

sunglin Yesterday 20:45

Enabling D2W / D2D Hybrid Bonding on manufacturing equipment based on simulated process parameters

IEEE
30 points

1 Reply

sunglin Yesterday 20:44

Integration Solution for Thin D2w Hybrid Bonding for Yield and Reliability

IEEE
30 points

1 Reply

sunglin Yesterday 20:44

Sidewall Crack Improvement in the Mechanical Wafer Dicing Process

IEEE
10 points

1 Reply

Rangers Yesterday 20:44

Broadly Applicable Copper(I)-Catalyzed Alkyne Semihydrogenation and Hydrogenation of α,β-Unsaturated Amides Enabled by Bifunctional Iminopyridine Ligands

ACS
30 points

1 Reply

sunglin Yesterday 20:43

Review of wafer dicing techniques for via-middle process 3DI/TSV ultrathin silicon device wafers

IEEE
30 points

1 Reply

sunglin Yesterday 20:43

Investigation of Advanced Dicing Technologies for Ultra Low-k and 3D Integration

IEEE

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