[Elsevier] Diamond/Cu composites microchannel heat sink for effective thermal management of SiC power devices

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journalㄩApplied Thermal Engineering

AuthorsㄩKangyong Li; Rong Zhang; Kai Yang; Haoran Shen; Jialiang Chen; FanFan Wang; Jian Huang; Zexin Liu; Yue Yue; Zhiqiang Wang; Guoqing Xin

Published dateㄩ2026-1-

DOIㄩ10.1016/j.applthermaleng.2025.129116

PDF linkㄩhttps://www.sciencedirect.com/sc ... 359431125037081/pdf

Article linkㄩhttps://doi.org/10.1016/j.applthermaleng.2025.129116

Article SourceㄩElsevier BV


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