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[IEEE] A novel plasma etching technology of RIE-lag free TSV and dicing processes for 3D chiplets interconnect

sunglin Post time 3 day(s) ago | Show all posts |Read mode
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journal：2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

Authors：Taichi Suzuki; Kenta Doi; Toshiyuki Nakamura; Yasuhiro Morikawa

Published date：2024-5-28

DOI：10.1109/ectc51529.2024.00328

PDF link：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10565140

Article link：https://doi.org/10.1109/ectc51529.2024.00328

Article Source：IEEE。


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