A Through Silicon Via (TSV) Architecture of the Bumpless Build Cube (BBCube) for Stacked Memory Devices

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journal：IEEE Journal on Emerging and Selected Topics in Circuits and Systems

Authors：Shinji Sugatani; Hiroyuki Ryoson; Norio Chujo; Masao Taguchi; Koji Sakui; Takayuki Ohba

Published date：2025-9-

DOI：10.1109/jetcas.2025.3591627

PDF link：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=11088080

Article link：https://doi.org/10.1109/jetcas.2025.3591627

Article Source：Institute of Electrical and Electronics Engineers (IEEE)。

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