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[IEEE] Thin Wafer De-bonding for 3D-TSV Packaging of High Bandwidth Memory Devices using UV Irradiation

sunglin Post time 3 day(s) ago | Show all posts |Read mode
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journal：2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

Authors：Yongchul Shin; Kyungran Kim; Minjae Shin; Hyunjin Lee; Nung-Pyo Hong; Kyungbin Lim; Minwoo Rhee

Published date：2021-12-7

DOI：10.1109/eptc53413.2021.9663988

PDF link：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=9663988

Article link：https://doi.org/10.1109/eptc53413.2021.9663988

Article Source：IEEE。


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