[Elsevier] A modified Qian-Liu constitutive model based on advanced packaging underfill materials

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journal:Materials Science in Semiconductor Processing

Authors:Tao He; Zhao Zhang; Shizhao Wang; Fang Dong; Sheng Liu

Published date:2024-6-

DOI:10.1016/j.mssp.2024.108340

PDF link:https://www.sciencedirect.com/sc ... 369800124002361/pdf

Article link:https://doi.org/10.1016/j.mssp.2024.108340

Article Source:Elsevier BV


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