[Other] Low-Cycle Fatigue of Sintered Silver in Polymeric-Substrate Printed Hybrid Electronic Assemblies Subject to Extreme Strain Induced by Mechanical Shock

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journalㄩJournal of Electronic Packaging

AuthorsㄩHayden Richards; Abhijit Dasgupta; Andres Bujanda; Harvey Tsang; Matthew Bowman

Published dateㄩ2025-12-1

DOIㄩ10.1115/1.4069321

PDF linkㄩhttps://asmedigitalcollection.as ... 5504/ep-25-1048.pdf

Article linkㄩhttps://doi.org/10.1115/1.4069321

Article SourceㄩASME International


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