[IEEE] High-Density Polymer Waveguide Integration on Glass Substrate for CPO

SemiJasper Post time 3 day(s) ago | Show all posts |Read mode
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journalㄩ2026 IEEE 76th Electronic Components and Technology Conference (ECTC)

AuthorsㄩTakuya Kitainui; Yujiro Saito; Naoki Fukuda; Kenichi Ogawa

Published dateㄩ2026-5-26

DOIㄩ10.1109/ectc51846.2026.00110

PDF linkㄩhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=11561465

Article linkㄩhttps://doi.org/10.1109/ectc51846.2026.00110

Article SourceㄩIEEE


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