Advanced Packaging Technology of GaN HEMT Module for High-Power and High-Frequency Applications: A Review

Post time 3 day(s) ago

journal：IEEE Transactions on Components, Packaging and Manufacturing Technology

Authors：Meiyu Wang; Peng Gao; Fangmin Shi; Weibo Hu; Xudong Wang; Haidong Yan; Yunhui Mei

Published date：2024-9-

DOI：10.1109/tcpmt.2024.3447079

PDF link：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10643466

Article link：https://doi.org/10.1109/tcpmt.2024.3447079

Article Source：Institute of Electrical and Electronics Engineers (IEEE)。

Remark：

Post time 3 day(s) ago

: Waiting for confirmation
If the PDF has not been accepted after 72 hours, the system will automatically adopt it.

[IEEE] Advanced Packaging Technology of GaN HEMT Module for High-Power and High-Frequency Applications: A Review

Same Category

Latest Reply

Announcement

Daily Top Contributors

[IEEE] Advanced Packaging Technology of GaN HEMT Module for High-Power and High-Frequency Applications: A Review Copy

Same Category

Latest Reply

Announcement

Daily Top Contributors

[IEEE] Advanced Packaging Technology of GaN HEMT Module for High-Power and High-Frequency Applications: A Review