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[IEEE] Development of glass core multilayer build-up substrate with TGV

SemiJasper Post time 3 day(s) ago | Show all posts |Read mode
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journalㄩ2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS)

AuthorsㄩJun Yoshiike; Masahiro Sunohara; Gai Kadoishi; Yoko Nakabayashi; Noriyoshi Shimizu; Ryuichi Matsuki

Published dateㄩ2026-4-14

DOIㄩ10.23919/icep-hbs69241.2026.11550498

PDF linkㄩhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=11550498

Article linkㄩhttps://doi.org/10.23919/icep-hbs69241.2026.11550498

Article SourceㄩIEEE﹝


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Sweetums33 Post time 3 day(s) ago | Show all posts

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