[Elsevier] Impedance discontinuity compensation and optimization for interconnection of coaxial TSV and RDL based on the principle of open stub matching

blue_cheese Post time Yesterday 12:02 | Show all posts |Read mode
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journalㄩMicroelectronics Journal

AuthorsㄩXin Luo; Gang Dong; Changle Zhi; Xinqing Lei; Shiping Mao

Published dateㄩ2026-9-

DOIㄩ10.1016/j.mejo.2026.107327

PDF linkㄩhttps://www.sciencedirect.com/sc ... 879239126002833/pdf

Article linkㄩhttps://doi.org/10.1016/j.mejo.2026.107327

Article SourceㄩElsevier BV


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