[IEEE] Direct Cu-polyimide Bonding Achieved by Surface Activation and Pt-catalyzed Formic Acid Atmosphere

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journalㄩ2021 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)

AuthorsㄩYing Meng; Runhua Gao; Xinhua Wang; Xiaojuan Chen; Sen Huang; Ke Wei; Dahai Wang; Fengwen Mu; Xinyu Liu

Published dateㄩ2021-11-24

DOIㄩ10.1109/icta53157.2021.9661693

PDF linkㄩhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=9661693

Article linkㄩhttps://doi.org/10.1109/icta53157.2021.9661693

Article SourceㄩIEEE


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