[IEEE] Study on CMP process of glass wafers with SiO2 based slurry for trench-glass-via interposer

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journalㄩ2016 China Semiconductor Technology International Conference (CSTIC)

AuthorsㄩChao-Chang A. Chen; Hong-Tsu Young; Ching-Hui Chiou; Min-Yue Xue; Chen-Lung Pan

Published dateㄩ2016-3-

DOIㄩ10.1109/cstic.2016.7464034

PDF linkㄩhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=7464034

Article linkㄩhttps://doi.org/10.1109/cstic.2016.7464034

Article SourceㄩIEEE


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