[Emerald] Nanocopper-based low-temperature interconnection technology: advances in material systems, sintering mechanisms and packaging applications

formyscience Post time 2026-7-10 18:16:07 | Show all posts |Read mode
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journalㄩSoldering & Surface Mount Technology

AuthorsㄩYe Tian; Haojie Chen; Lushan Ma; Chao Wang; Ziqiang Li; Lei Ma; Yongfeng Dong; Xing Chen

Published dateㄩ2026-6-17

DOIㄩ10.1108/ssmt-01-2026-0006

PDF linkㄩhttps://www.emerald.com/ssmt/art ... -01-2026-0006en.pdf

Article linkㄩhttps://doi.org/10.1108/ssmt-01-2026-0006

Article SourceㄩEmerald


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Gaaligraphy Post time 2026-7-10 18:16:08 | Show all posts

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