[Other] Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction

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journalㄩJournal of Electronic Packaging

AuthorsㄩRobert Darveaux

Published dateㄩ2002-9-1

DOIㄩ10.1115/1.1413764

PDF linkㄩhttp://asmedigitalcollection.asm ... 7/5802650/147_1.pdf

Article linkㄩhttps://doi.org/10.1115/1.1413764

Article SourceㄩASME International


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