[Elsevier] Analytical Impedance Matching Method, and Surrogate Models for Coaxial TSV每RDL Transitions in High-Speed Chiplet Interconnects

blue_cheese Post time 2026-7-23 15:49:23 | Show all posts |Read mode
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journalㄩMicroelectronics Journal

AuthorsㄩFengjuan Wang; Xu Lu; Xiangkun Yin; Jiangfan Liu; Ying Yang; Libo Qian; Yinshui Xia; Yuan Yang; Ningmei Yu; Mingbin Yu; Yan Li

Published dateㄩ2026-7-

DOIㄩ10.1016/j.mejo.2026.107406

PDF linkㄩhttps://www.sciencedirect.com/sc ... 879239126003620/pdf

Article linkㄩhttps://doi.org/10.1016/j.mejo.2026.107406

Article SourceㄩElsevier BV


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