[Other] Design and Analysis of Bonding Wire for Ka-Band QFN Package

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journalㄩThe Journal of Korean Institute of Electromagnetic Engineering and Science

AuthorsㄩWenjie Wang; Wonshil Kang; Hyunchul Ku

Published dateㄩ2021-11-

DOIㄩ10.5515/kjkiees.2021.32.11.951

PDF linkㄩhttp://jkiees.org/download/downl ... IEES.2021.32.11.951

Article linkㄩhttps://doi.org/10.5515/kjkiees.2021.32.11.951

Article SourceㄩKorean Institute of Electromagnetic Engineering and Science


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