[IEEE] Analysis of Bondwires and RF Compensation Circuits in E-Band

nmchau_rfs3 Post time 2026-7-23 19:54:21 | Show all posts |Read mode
This post will be closed automatically in 2026-07-26 19:54
Reward30points

journalㄩIEEE Transactions on Components, Packaging and Manufacturing Technology

AuthorsㄩSumin David Joseph; Edward A. Ball

Published dateㄩ2025-9-

DOIㄩ10.1109/tcpmt.2025.3594505

PDF linkㄩhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=11105498

Article linkㄩhttps://doi.org/10.1109/tcpmt.2025.3594505

Article SourceㄩInstitute of Electrical and Electronics Engineers (IEEE)


Remarkㄩ

Best Answer

Reply

Use magic Donate Report

All Reply2 Show all posts
jakir_ete_ruet Post time 2026-7-23 19:54:22 | Show all posts

This post has been completed

Completed attachments will be deleted within 24 hours.
Reply

Use magic Donate Report

ecandiota Post time 2026-7-23 19:55:57 | Show all posts

This post has been completed

Completed attachments will be deleted within 24 hours.
Reply

Use magic Donate Report

Return to the list