[IEEE] Integrated Metal-Lidded Microfluidic Cooling on a High-Power AI Chip Using Confined Two-Phase Liquid Jet With Dielectric Fluid R1233zd(E)

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journalㄩIEEE Transactions on Components, Packaging and Manufacturing Technology

AuthorsㄩGopinath Sahu; Sidharth Rajeev; Duc Hoang; Harish Kumar Lattupalli; Srikanth Rangarajan; Bahgat G. Sammakia; Scott Schiffres; Tiwei Wei

Published dateㄩ2025-12-

DOIㄩ10.1109/tcpmt.2025.3623470

PDF linkㄩhttps://ieeexplore.ieee.org/iela ... 14/11207724-aam.pdf

Article linkㄩhttps://doi.org/10.1109/tcpmt.2025.3623470

Article SourceㄩInstitute of Electrical and Electronics Engineers (IEEE)


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