[RSC] Air-sinterable copper pastes for next-generation electronics: a review

formyscience Post time 6 day(s) ago | Show all posts |Read mode
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journalㄩJournal of Materials Chemistry C

AuthorsㄩXinyi Shi; Songtang Li; Su Ding; Minggang Li; Junfeng Sun; Ke Li; Wanli Li

Published dateㄩ--

DOIㄩ10.1039/d5tc04491j

PDF linkㄩhttp://pubs.rsc.org/en/content/articlepdf/2026/TC/D5TC04491J

Article linkㄩhttps://doi.org/10.1039/d5tc04491j

Article SourceㄩRoyal Society of Chemistry (RSC)


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muktadir.rahman Post time 6 day(s) ago | Show all posts

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