[IEEE] Ultra thin die pickup: peel stage and pickup tool design comparison

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journalㄩ2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

AuthorsㄩStefan Behler; Brian Pulis

Published dateㄩ2022-12-7

DOIㄩ10.1109/eptc56328.2022.10013217

PDF linkㄩhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10013217

Article linkㄩhttps://doi.org/10.1109/eptc56328.2022.10013217

Article SourceㄩIEEE


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