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[IEEE] STI Silicon Etch Process Wafer Uniformity Improvement Using Out-of-Phase Coil Current and Motorized Radial Assembly Dial

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journalㄩ2026 37th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

AuthorsㄩPete Pusamlidlert; Edward Ibinson; Ganquan Song; Thien Lai

Published dateㄩ2026-5-11

DOIㄩ10.1109/asmc69324.2026.11551175

PDF linkㄩhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=11551175

Article linkㄩhttps://doi.org/10.1109/asmc69324.2026.11551175

Article SourceㄩIEEE﹝


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