[IEEE] Effect of Pre-Annealing Time of Ti/Ag Metallized Cu Substrate on Ag每Ag Direct Bonding for SiC Die Attach

formyscience Post time The day before yesterday 22:38 | Show all posts |Read mode
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journalㄩ2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS)

AuthorsㄩMinseo Kim; Sangmin Lee; Chuantong Chen; Seungmin Cho; Myung Sik Choi; Soongkeun Hyun; Katsuaki Suganuma

Published dateㄩ2026-4-14

DOIㄩ10.23919/icep-hbs69241.2026.11550481

PDF linkㄩhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=11550481

Article linkㄩhttps://doi.org/10.23919/icep-hbs69241.2026.11550481

Article SourceㄩIEEE


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jakir_ete_ruet Post time The day before yesterday 22:39 | Show all posts

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