[IEEE] Enabling D2W / D2D Hybrid Bonding on manufacturing equipment based on simulated process parameters

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journalㄩ2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

AuthorsㄩC. Rudolph; A. Hanisch; M. Voigtlander; P. Gansauer; H. Wachsmuth; S. Kuttler; O. Wittler; T. Werner; I. Panchenko; M.J. Wolf

Published dateㄩ2021-6-

DOIㄩ10.1109/ectc32696.2021.00018

PDF linkㄩhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=9501730

Article linkㄩhttps://doi.org/10.1109/ectc32696.2021.00018

Article SourceㄩIEEE


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