[IEEE] Investigation of Advanced Dicing Technologies for Ultra Low-k and 3D Integration

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journalㄩ2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

AuthorsㄩA. Podpod; F. Inoue; I. De Wolf; M. Gonzalez; M. K. Rebibis; R. A. Miller; E. Beyne

Published dateㄩ2016-5-

DOIㄩ10.1109/ectc.2016.28

PDF linkㄩhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=7545585

Article linkㄩhttps://doi.org/10.1109/ectc.2016.28

Article SourceㄩIEEE


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