[IEEE] Sidewall Crack Improvement in the Mechanical Wafer Dicing Process

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journalㄩ2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)

AuthorsㄩShazealina Abd Sukor

Published dateㄩ2022-10-19

DOIㄩ10.1109/iemt55343.2022.9969508

PDF linkㄩhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=9969508

Article linkㄩhttps://doi.org/10.1109/iemt55343.2022.9969508

Article SourceㄩIEEE


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