[IEEE] Integration Solution for Thin D2w Hybrid Bonding for Yield and Reliability

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journalㄩ2025 IEEE 75th Electronic Components and Technology Conference (ECTC)

AuthorsㄩXiao Dong Chen; Guan Huei See; Yin Wei Lim; Prayudi Lianto; Peng Suo; Chang Bum Yong Andy; Santosh Kumar Rath; Xing Zhao

Published dateㄩ2025-5-27

DOIㄩ10.1109/ectc51687.2025.00011

PDF linkㄩhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=11038049

Article linkㄩhttps://doi.org/10.1109/ectc51687.2025.00011

Article SourceㄩIEEE


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librarian666 Post time Yesterday 22:23 | Show all posts

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