[IEEE] A study on D2W Hybrid Cu bonding Technology for HBM Multi-die Stacking

sunglin Post time Yesterday 20:46 | Show all posts |Read mode
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journalㄩ2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

AuthorsㄩHyeonmin Lee; Jihoon Kim; Min-Ki Kim; Wonil Lee; Aeni Jang; Hyuekjae Lee; Dae-Woo Kim

Published dateㄩ2024-5-

DOIㄩ10.1109/ectc51529.2024.00021

PDF linkㄩhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10565170

Article linkㄩhttps://doi.org/10.1109/ectc51529.2024.00021

Article SourceㄩIEEE


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Sweetums33 Post time Yesterday 20:48 | Show all posts

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