[IEEE] A study on packaging design of SiC power module using near-field magnetic scanning techniques

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journalㄩ2017 IEEE International Workshop On Integrated Power Packaging (IWIPP)

AuthorsㄩTakaaki Ibuchi; Eisuke Masuda; Tsuyoshi Funaki; Hirotaka Otake; Tatsuya Miyazaki; Yasuo Kanetake; Takashi Nakamura

Published dateㄩ2017-4-

DOIㄩ10.1109/iwipp.2017.7936770

PDF linkㄩhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=7936770

Article linkㄩhttps://doi.org/10.1109/iwipp.2017.7936770

Article SourceㄩIEEE


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