[Other] Stable Fluxless Thermo-Compression Bonding in Ultrafine-Pitch Packaging: Oxide Reduction Validated by XPS

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journalㄩWafer-Level Packaging Symposium

AuthorsㄩMartin Kainz; Benedikt Pressl; Andreas Unterrainer; Jonathan Abdilla; Roland Barbosa; Mike Mac Mahon; Wei Ti Lee; Avron Ger

Published dateㄩ2026-2-

DOIㄩ10.37665/wawswos48619

PDF linkㄩhttps://smta.kglmeridian.com/vie ... 2/1/article-p35.xml

Article linkㄩhttps://doi.org/10.37665/wawswos48619

Article SourceㄩSurface Mount Technology Association


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