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[IEEE] Full-Wave Analysis for Ground Via Placement with Layered Media Integral Equations

C@sanova Post time 13 hour(s) ago | Show all posts |Read mode
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journalㄩ2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

AuthorsㄩAlireza Niazi; Vladimir Okhmatovski

Published dateㄩ2024-10-6

DOIㄩ10.1109/epeps61853.2024.10753763

PDF linkㄩhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10753763

Article linkㄩhttps://doi.org/10.1109/epeps61853.2024.10753763

Article SourceㄩIEEE﹝


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