PEEC Modeling in 3D IC/Packaging Applications Based on Layered Green's Functions

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journal：IEEE Transactions on Signal and Power Integrity

Authors：Biyao Zhao; Siqi Bai; Jun Fan; Brice Achkir; Albert Ruehli

Published date：2023--

DOI：10.1109/tsipi.2023.3244893

PDF link：https://ieeexplore.ieee.org/iela ... 18/10045792-aam.pdf

Article link：https://doi.org/10.1109/tsipi.2023.3244893

Article Source：Institute of Electrical and Electronics Engineers (IEEE)。

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[IEEE] PEEC Modeling in 3D IC/Packaging Applications Based on Layered Green's Functions

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