[Elsevier] Novel transient liquid phase bonding method using In-coated Cu sheet for high-temperature die attach

Sweetums33 Post time 8 min. ago | Show all posts |Read mode
This post will be closed automatically in 2026-08-28 16:16
Reward100points

journalㄩMaterials Research Bulletin

AuthorsㄩJianhao Wang; Xunda Liu; Fupeng Huo; Kento Kariya; Noriyuki Masago; Hiroshi Nishikawa

Published dateㄩ2022-5-

DOIㄩ10.1016/j.materresbull.2021.111713

PDF linkㄩhttps://www.sciencedirect.com/sc ... 025540821005109/pdf

Article linkㄩhttps://doi.org/10.1016/j.materresbull.2021.111713

Article SourceㄩElsevier BV


Remarkㄩ

Best Answer

Please approve

View Full Content

Reply

Use magic Donate Report

All Reply1 Show all posts
Kishore_Avaru Post time 8 min. ago | Show all posts

This post has been completed

Completed attachments will be deleted within 24 hours.
Reply

Use magic Donate Report

Senior Member
  • post

  • reply

  • points

    233052


Return to the list