[Other] Effect of Superfilling and Leveling Inhibitors in Hybrid Additives on the Microstructure Evolution of Electroplated Copper Interconnect Films during Self-Annealing

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journal:Journal of The Electrochemical Society

Authors:Silin Han; Mengyun Zhang; Yuhang Chen; Yunwen Wu; Ming Li; Tao Hang

Published date:2024-9-2

DOI:10.1149/1945-7111/ad7d3e

PDF link:https://iopscience.iop.org/article/10.1149/1945-7111/ad7d3e

Article link:https://doi.org/10.1149/1945-7111/ad7d3e

Article Source:The Electrochemical Society


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