[ACS] Low-CTE, Strong-Adhesion, and High-Resolution Photosensitive Polyimide Materials for Advanced Packaging Applications: Structure and Properties

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journal:ACS Applied Polymer Materials

Authors:Huifa Meng; Kaijin Chen; Chuying Li; Yanwei He; Zihao Huang; Haitao Huang; Zhenguo Chi; Siwei Liu; Yi Zhang

Published date:2025-3-28

DOI:10.1021/acsapm.5c00001

PDF link:https://pubs.acs.org/doi/pdf/10.1021/acsapm.5c00001

Article link:https://doi.org/10.1021/acsapm.5c00001

Article Source:American Chemical Society (ACS)


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