Organics-free Porous Nano-dendritic Cu Films for High-Power Packaging Interconnects

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journal：2026 IEEE 76th Electronic Components and Technology Conference (ECTC)

Authors：Fatin Battal; Nikhil Gupta; Ruben Pranger; Jeroen Maasen; Peter Mulder; René Poelma; Elias Vlieg; John Schermer

Published date：2026-5-26

DOI：10.1109/ectc51846.2026.00392

PDF link：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=11561188

Article link：https://doi.org/10.1109/ectc51846.2026.00392

Article Source：IEEE。

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[IEEE] Organics-free Porous Nano-dendritic Cu Films for High-Power Packaging Interconnects

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