[Nature] Thermal management materials for 3D-stacked integrated circuits

LZD1 Post time 6 day(s) ago | Show all posts |Read mode
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Title:  Thermal management materials for 3D-stacked integrated circuits
DOI:  10.1038/s44287-025-00196-0
Website:  Thermal management materials for 3D-stacked integrated circuits | Nature Reviews Electrical Engineering

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