[Wiley] Air㏒intering of Dual㎜igand Capped Copper Nanoparticles for High㏕emperature Interconnect Applications

18cheung Post time 5 day(s) ago | Show all posts |Read mode
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期刊:cMat

作者:郑宇吉;袁俊杰;李庆华;孙哲飞;王恒辉;吴向;李体训;周子玉;夏世玉;李金堂;曹慧君;蔡文志;钟焕·苏尔;张志浩

发表日期:2025-3-

DOI:10.1002/cmt2.70001

PDF链接:https://onlinelibrary.wiley.com/doi/pdfdirect/10.1002/cmt2.70001

文章链接:https://doi.org/10.1002/cmt2.70001

文章来源:Wiley


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