[ACS] Highly Conductive Cu–Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles

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期刊:ACS应用材料与界面

作者:刘景东;陈洪涛;季洪军;李明宇

发表日期:2016年12月7日

DOI:10.1021/acsami.6b10280

PDF链接:https://pubs.acs.org/doi/pdf/10.1021/acsami.6b10280

文章链接:https://doi.org/10.1021/acsami.6b10280

文章来源:美国化学学会(ACS)


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