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[IEEE] A novel flow to optimize package power distribution network design

podkovyr3000 Post time 5 day(s) ago | Show all posts |Read mode
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journal：2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Authors： Cheng-Yu Tsai;  Hung-Chun Kuo;  Chih-Yi Huang;  Chen-Chao Wang

Published date：2015-10-

DOI：10.1109/impact.2015.7365242

PDF link：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=7365242

Article link：https://doi.org/10.1109/impact.2015.7365242

Article Source：IEEE。


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