[IEEE] TDXRay: Microarchitectural Side-Channel Analysis of Intel TDX for Real-World Workloads

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journal:2026 IEEE Symposium on Security and Privacy (SP)

Authors:Tristan Hornetz; Hosein Yavarzadeh; Albert Cheu; Adria Gascon; Lukas Gerlach; Daniel Moghimi; Phillipp Schoppmann; Michael Schwarz; Ruiyi Zhang

Published date:2026-5-18

DOI:10.1109/sp63933.2026.00170

PDF link:https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=11573580

Article link:https://doi.org/10.1109/sp63933.2026.00170



Article Source:IEEE。



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