[IEEE] Analysis of Electromagnetic Interference Problems Caused by Split Reference Plane on High-Speed Multilayer Boards

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journal:2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)

Authors:Xin Fang; Chulsoon Hwang; Michelle Liu; Rodrigo Rodriguez Navarrete

Published date:2023-7-29

DOI:10.1109/emcsipi50001.2023.10241478

PDF link:https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10241478

Article link:https://doi.org/10.1109/emcsipi50001.2023.10241478

Article Source:IEEE


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