Fluorine-free and PEB-less i-line chemically amplified resist for panel level packaging (PLP)

Post time Yesterday 07:58

journal：Advances in Patterning Materials and Processes XLIII

Authors：Lei Lu; Hung-Yang Chen; Shinya Akechi; Chunwei Chen; Jaehyun Kim

Published date：2026-4-9

DOI：10.1117/12.3090767

Article link：https://doi.org/10.1117/12.3090767

Article Source：SPIE。

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[SPIE] Fluorine-free and PEB-less i-line chemically amplified resist for panel level packaging (PLP)

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