[Elsevier] High yield four-point bend thin film adhesion testing techniques

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journal:Engineering Fracture Mechanics

Authors:Ryan P. Birringer; Paula J. Chidester; Reinhold H. Dauskardt

Published date:2011-8-

DOI:10.1016/j.engfracmech.2011.05.010

PDF link:https://www.sciencedirect.com/sc ... 013794411002001/pdf

Article link:https://doi.org/10.1016/j.engfracmech.2011.05.010

Article Source:Elsevier BV


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